Inventor · disambiguated record
Jae-Young Hong
Also filed as: HONG JAE-YOUNG
6 granted patents·1 pending application·25 citations·filing 2004–2018
80Inventor score
Top patents by PatentIndex Score
7 records- 0176US10610373B2Spinal complex cageMEDYSSEY CO LTD·Filed 2017·Granted Apr 7, 2020·6 cites·7 claims
- 0272US7374966B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 20, 2008·5 cites·2 claims
- 0368US7396763B2Semiconductor package using flexible film and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 8, 2008·5 cites·14 claims
- 0452US7135353B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 14, 2006·5 cites·8 claims
- 0547US7042104B2Semiconductor package using flexible film and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 9, 2006·4 cites·13 claims
- 0647US2008191364A1Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0738US10638614B2Semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →