Inventor · disambiguated record
Jachson Hsieh
Also filed as: HSIEH JACHSON
1 granted patent·3 pending applications·46 citations·filing 2002–2002
48Inventor score
Files withKINGPAK TECH INC1
Top patents by PatentIndex Score
4 records- 0183US6590269B1Package structure for a photosensitive chipKINGPAK TECH INC·Filed 2002·Granted Jul 8, 2003·46 cites·2 claims
- 0230US2004113218A1Photosensitive assembly with a transparent layer and method for manufacturing the sameFiled 2002·Application pending·0 cites
- 0330US2003213124A1Method for packaging image sensorsFiled 2002·Application pending·0 cites
- 0430US2003213891A1Image sensorFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →