Inventor · disambiguated record
Jaw-Shiun Hsieh
Also filed as: HSIEH JAW-SHIUN
2 granted patents·2 pending applications·27 citations·filing 1999–2002
59Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
4 records- 0159US6244499B1Structure of a ball bump for wire bonding and the formation thereofADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jun 12, 2001·24 cites·2 claims
- 0243US6429049B1Laser method for forming viasADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Aug 6, 2002·3 cites·17 claims
- 0334US2001022315A1Structure of a ball bump for wire bonding and the formation thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Application pending·0 cites
- 0431US2002195721A1Cavity down ball grid array packaging structureFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →