Inventor · disambiguated record
James R. Huckabee
Also filed as: HUCKABEE JAMES · HUCKABEE JAMES R · HUCKABEE JAMES RICHARD
7 granted patents·3 pending applications·31 citations·filing 2002–2025
80Inventor score
Top patents by PatentIndex Score
10 records- 0187US8916408B2Leadframe-based premolded package having air channel for microelectromechanical system (MEMS) deviceTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 23, 2014·12 cites·20 claims
- 0277US7712999B1Method and apparatus for drying soilHUCKABEE JAMES·Filed 2007·Granted May 11, 2010·11 cites·20 claims
- 0375US2025318318A1Integrated filter optical packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0474US8530981B2Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical systemHUCKABEE JAMES RICHARD·Filed 2010·Granted Sep 10, 2013·6 cites·15 claims
- 0565US7871864B2Locking feature and method for manufacturing transfer molded IC packagesTEXAS INSTRUMENTS INC·Filed 2010·Granted Jan 18, 2011·2 cites·8 claims
- 0654US12364052B2Integrated filter optical packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 15, 2025·0 cites·34 claims
- 0747US7701073B2Locking feature and method for manufacturing transfer molded IC packagesTEXAS INSTRUMENTS INC·Filed 2007·Granted Apr 20, 2010·0 cites·14 claims
- 0846US11018111B2Wafer level derived flip chip packageTEXAS INSTRUMENTS INC·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 0940US2020035577A1Packaged integrated circuitTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 1027US2004012077A1Semiconductor leadframes having dual surface finish for varied molding compound adhesionFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →