Inventor · disambiguated record
Jae-Seon Hwang
Also filed as: HWANG JAE-SEON
6 granted patents·1 pending application·61 citations·filing 2009–2024
80Inventor score
Top patents by PatentIndex Score
7 records- 0179USD772428SCartridge housingBODITECHMED INC·Filed 2015·Granted Nov 22, 2016·28 cites·1 claims
- 0278US8915042B2Steel frame structure using U-shaped composite beamAHN TAE SANG·Filed 2013·Granted Dec 23, 2014·22 cites·6 claims
- 0370US8385079B2Pressure conductive sheetSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 26, 2013·4 cites·14 claims
- 0468US8616907B2Test socket for testing electrical characteristics of a memory moduleKIM JUNG-HOON·Filed 2011·Granted Dec 31, 2013·6 cites·20 claims
- 0565US11011473B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·1 cites·17 claims
- 0659US2025105203A1Soldering apparatus, method for manufacturing semiconductor package using the same, and method for manufacturing soldering apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0737US10971376B2Printed circuit board with protective member and method of manufacturing semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 6, 2021·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Jae-Seon Hwang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →