Inventor · disambiguated record
Jaeseok Jang
Also filed as: JANG JAESEOK
5 granted patents·2 pending applications·2 citations·filing 2011–2025
62Inventor score
Top patents by PatentIndex Score
7 records- 0164US10521849B2User terminal for providing in-app service and in-app service serverAHN HEEJUNG·Filed 2011·Granted Dec 31, 2019·1 cites·23 claims
- 0263US10373229B2In-app recommendation system and user terminalAHN HEEJUNG·Filed 2011·Granted Aug 6, 2019·1 cites·9 claims
- 0360US2025391751A1Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0453US2024100634A1Lead-free solder alloy composition, solder ball including the same, solder paste including the lead-free solder alloy composition, semiconductor device including hybrid bonding structure including the lead-free solder alloy composition, and method of manufacturing solder paste including the lead-free solder alloy compositionSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0545US11758652B2Printed circuit board and semiconductor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0642US9996887B2System for providing authoring service and user terminal for providing authoring serviceAHN HEEJUNG·Filed 2011·Granted Jun 12, 2018·0 cites·12 claims
- 0738US11523506B2Module board and memory module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →