Inventor · disambiguated record

Jason A. Keleher

Also filed as: KELEHER JASON A

1 granted patent·2 pending applications·0 citations·filing 2022–2022

14Inventor score

Technology areasH10P

Files withARACA INC3

Top patents by PatentIndex Score

3 records

0159US12448545B2Silicon carbide (SIC) wafer polishing with slurry formulation and processARACA INC·Filed 2022·Granted Oct 21, 2025·0 cites·22 claims
0245US2025101261A1Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the sameARACA INC·Filed 2022·Application pending·0 cites
0338US2024379371A1Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the sameARACA INC·Filed 2022·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →