Inventor · disambiguated record
Jae Hak Kim
Also filed as: KIM JAE H · KIM JAE HAK · KIM JAE K
40 granted patents·12 pending applications·327 citations·filing 1994–2024
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25GENERAL NANO LLC4HYUNDAI MOTOR CO LTD4KOREA RES INST CHEM TECH3CHOI JUN YOUNG1
Top patents by PatentIndex Score
52 records- 0197US9353984B2Refrigerator having double doorsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 31, 2016·56 cites·19 claims
- 0285US6828229B2Method of manufacturing interconnection line in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 7, 2004·33 cites·18 claims
- 0384US12397926B2Vertiport system including transfer unit using rail moving deviceHYUNDAI MOTOR CO LTD·Filed 2024·Granted Aug 26, 2025·1 cites·18 claims
- 0482US6432843B1Methods of manufacturing integrated circuit devices in which a spin on glass insulation layer is dissolved so as to recess the spin on glass insulation layer from the upper surface of a patternSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 13, 2002·26 cites·20 claims
- 0580US7488687B2Methods of forming electrical interconnect structures using polymer residues to increase etching selectivity through dielectric layersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·7 cites·20 claims
- 0680US6861347B2Method for forming metal wiring layer of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 1, 2005·31 cites·54 claims
- 0777US7662810B22-arylmethylazetidine carbapenem derivatives and preparation thereofKOREA RES INST CHEM TECH·Filed 2005·Granted Feb 16, 2010·2 cites·10 claims
- 0877US2025074621A1Conductive broad good providing lightning strike protectionGENERAL NANO LLC·Filed 2024·Application pending·0 cites
- 0976US7323407B2Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base materialSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 29, 2008·8 cites·43 claims
- 1076US7183195B2Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic fillerSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 27, 2007·24 cites·51 claims
- 1175US9499537B2Antiviral pyrrolopyridine derivatives and method for preparing the sameKOREA RES INST CHEMICAL TECH·Filed 2014·Granted Nov 22, 2016·3 cites·19 claims
- 1274US9018088B2Method of manufacturing electrodes using carbon nanotube sheetsUNIV TEXAS·Filed 2013·Granted Apr 28, 2015·1 cites·14 claims
- 1374US7192864B2Method of forming interconnection lines for semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 20, 2007·5 cites·16 claims
- 1473US7993565B2Folding and shape-forming apparatus and method for prepregKOREAN AIR LINES CO LTD·Filed 2009·Granted Aug 9, 2011·4 cites·12 claims
- 1573US6815331B2Method for forming metal wiring layer of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 9, 2004·20 cites·17 claims
- 1671US8053435B2Naphthalenyloxypropenyl derivatives having inhibitory activity against histone deacetylase and pharmaceutical composition comprising the sameKOREA RES INST CHEM TECH·Filed 2007·Granted Nov 8, 2011·2 cites·13 claims
- 1770US7847402B2BEOL interconnect structures with improved resistance to stressIBM·Filed 2007·Granted Dec 7, 2010·4 cites·13 claims
- 1870US7541276B2Methods for forming dual damascene wiring for semiconductor devices using protective via capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 2, 2009·6 cites·38 claims
- 1967US7687381B2Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewallSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 30, 2010·4 cites·18 claims
- 2067US6858727B2Intermediate of carbapenem antibiotics and process for the preparation thereofDONG WHA PHARM IND CO LTD·Filed 2001·Granted Feb 22, 2005·5 cites·5 claims
- 2166US7635645B2Method for forming interconnection line in semiconductor device and interconnection line structureSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 22, 2009·6 cites·6 claims
- 2266US7064059B2Method of forming dual damascene metal interconnection employing sacrificial metal oxide layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 20, 2006·12 cites·20 claims
- 2365US12184205B2System for estimating rotor resistance of an induction motorHYUNDAI MOTOR CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·7 claims
- 2465US8409768B2Tuning of Fe catalysts for growth of spin-capable carbon nanotubesKIM JAE HAK·Filed 2010·Granted Apr 2, 2013·1 cites·23 claims
- 2565US5453793AMethod for recording a series program in a video cassette recorderDAEWOO ELECTRONICS CO LTD·Filed 1994·Granted Sep 26, 1995·23 cites·1 claims
- 2664US6855629B2Method for forming a dual damascene wiring pattern in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 15, 2005·12 cites·18 claims
- 2763US6849536B2Inter-metal dielectric patterns and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·12 cites·28 claims
- 2861US12092794B2Anti-glare film, polarizing plate and display apparatusLG CHEMICAL LTD·Filed 2020·Granted Sep 17, 2024·0 cites·20 claims
- 2961US11817746B22-segment quasi-Halbach rotor of motorPOSTECH RES & BUSINESS DEV FOUND·Filed 2021·Granted Nov 14, 2023·0 cites·7 claims
- 3060US7022600B2Method of forming dual damascene interconnection using low-k dielectric materialSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 4, 2006·10 cites·12 claims
- 3158US6936533B2Method of fabricating semiconductor devices having low dielectric interlayer insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 30, 2005·6 cites·18 claims
- 3257US2025178747A1Apparatus and method for moving aircraftHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 3353US2025197024A1Vertiport system including transfer apparatus using cableHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 3452US12421653B2Electrically-conductive broad goodGENERAL NANO LLC·Filed 2020·Granted Sep 23, 2025·0 cites·18 claims
- 3551US9430985B2Display device and method of driving the sameLG DISPLAY CO LTD·Filed 2013·Granted Aug 30, 2016·0 cites·16 claims
- 3651US2009075474A1Methods for forming dual damascene wiring using porogen containing sacrificial via filler materialLEE KYOUNG WOO·Filed 2008·Application pending·0 cites
- 3748US11919656B2Conductive broad good providing lightning strike protectionGENERAL NANO LLC·Filed 2018·Granted Mar 5, 2024·0 cites·25 claims
- 3848US7737029B2Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 15, 2010·0 cites·18 claims
- 3948US7690557B2System and method for displaying received data using separate deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 6, 2010·0 cites·19 claims
- 4048US2009280637A1Method of manufacturing semiconductor device including ultra low dielectric constant layerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 4147US7041592B2Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 9, 2006·2 cites·23 claims
- 4246US9255204B2Cavitation resistant polyurethane compositions and methods of forming coating films using the sameCHOI JUN-YOUNG·Filed 2014·Granted Feb 9, 2016·0 cites·12 claims
- 4346US2007162948A1Personal video recorder apparatus providing an advertisement and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4445US2006121721A1Methods for forming dual damascene wiring using porogen containing sacrificial via filler materialSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4541US11214570B2Pyrrolopyridine derivative, method for producing same, and use thereofST PHARM CO LTD·Filed 2017·Granted Jan 4, 2022·0 cites·3 claims
- 4640US7307014B2Method of forming a via contact structure using a dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·0 cites·26 claims
- 4740US2007105362A1Methods of forming contact structures in low-k materials using dual damascene processesKIM JAE H·Filed 2005·Application pending·0 cites
- 4839US2005140236A1Rotor structure of multi-layer interior permanent magnet motorFiled 2004·Application pending·0 cites
- 4939US2020238576A1Heating blanket and method for useGENERAL NANO LLC·Filed 2018·Application pending·0 cites
- 5036US2002033486A1Method for forming an interconnection line using a hydrosilsesquioxane (HSQ) layer as an interlayer insulating layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →