Inventor · disambiguated record
Jae K. Kim
Also filed as: KIM JAE K · KIM JAE-KAP
82 granted patents·1,324 citations·filing 1990–2003
99Inventor score
Top patents by PatentIndex Score
82 records- 0188US6433376B2Ferroelectric memory integrated circuitDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Aug 13, 2002·41 cites·4 claims
- 0281US5780333AMethod of fabricating an analog semiconductor device having a salicide layerHYUNDAI ELECTRONICS IND·Filed 1997·Granted Jul 14, 1998·48 cites·2 claims
- 0379US5478770AMethods for manufacturing a storage electrode of DRAM cellsHYUNDAI ELECTRONICS IND·Filed 1995·Granted Dec 26, 1995·40 cites·5 claims
- 0478US6090652AMethod of manufacturing a semiconductor device including implanting threshold voltage adjustment ionsHYUNDAI ELECTRONICS IND·Filed 1997·Granted Jul 18, 2000·53 cites·15 claims
- 0578US5955746ASRAM having enhanced cell ratioHYUNDAI ELECTRONICS IND·Filed 1997·Granted Sep 21, 1999·34 cites·6 claims
- 0678US5413961AMethod for forming a contact of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted May 9, 1995·58 cites·9 claims
- 0777US5565372AMethod of manufacturing a self-aligned bit line contact to a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1994·Granted Oct 15, 1996·58 cites·27 claims
- 0876US5466637AMethod of making a self-aligned contact in semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted Nov 14, 1995·56 cites·6 claims
- 0975US5945712ASemiconductor device having a SOI structure with substrate bias formed through the insulator and in contact with one of the active diffusion layersHYUNDAI ELECTRONICS IND·Filed 1997·Granted Aug 31, 1999·41 cites·5 claims
- 1074US5149676ASilicon layer having increased surface area and method for manufacturingHYUNDAI ELECTRONICS IND·Filed 1991·Granted Sep 22, 1992·49 cites·21 claims
- 1171US6483152B1Semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Nov 19, 2002·12 cites·8 claims
- 1271US5315141ASemiconductor memory device having a double-stacked capacitor structureHYUNDAI ELECTRONICS IND·Filed 1993·Granted May 24, 1994·28 cites·2 claims
- 1370US5580811AMethod for the fabrication of a semiconductor memory device having a capacitorHYUNDAI ELECTRONICS IND·Filed 1995·Granted Dec 3, 1996·29 cites·8 claims
- 1469US5831305ACMOS devices having minimized drain contact areaHYUNDAI ELECTRONICS IND·Filed 1996·Granted Nov 3, 1998·32 cites·11 claims
- 1567US6487712B1Method of manufacturing mask for conductive wirings in semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Nov 26, 2002·11 cites·5 claims
- 1667US6069036AMethod of fabricating semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted May 30, 2000·29 cites·18 claims
- 1767US5569948ASemiconductor device having a contact plug and contact padHYUNDAI ELECTRONICS IND·Filed 1994·Granted Oct 29, 1996·37 cites·3 claims
- 1866US6333527B2Semiconductor device and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2001·Granted Dec 25, 2001·11 cites·2 claims
- 1966US5403767AMethods for manufacturing a storage electrode of DRAM cellsHYUNDAI ELECTRONICS IND·Filed 1992·Granted Apr 4, 1995·23 cites·5 claims
- 2065US6448134B2Method for fabricating semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Sep 10, 2002·12 cites·7 claims
- 2165US6372571B2Method of manufacturing semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Apr 16, 2002·12 cites·15 claims
- 2264US5573969AMethod for fabrication of CMOS devices having minimized drain contact areaHYUNDAI ELECTRONICS IND·Filed 1995·Granted Nov 12, 1996·27 cites·6 claims
- 2363US6001685AMethod of making a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted Dec 14, 1999·30 cites·7 claims
- 2461US5081066AMethod for forming a silicide film used in a semiconductor chipHYUNDAI ELECTRONICS IND·Filed 1990·Granted Jan 14, 1992·21 cites·7 claims
- 2560US6292385B1Ferroelectric random access memoryDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Sep 18, 2001·11 cites·51 claims
- 2659US6482695B1Method for fabricating semiconductor device including stacked capacitorsDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Nov 19, 2002·9 cites·12 claims
- 2758US5332693AMethod for manufacturing aluminum wired layer for interconnecting device to device in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1992·Granted Jul 26, 1994·27 cites·12 claims
- 2858US5081060AMethod for forming a connection device in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1990·Granted Jan 14, 1992·28 cites·4 claims
- 2957US6605508B2Semiconductor device and method of manufacturing thereofDONGBU ELECTRONICS CO LTD·Filed 2002·Granted Aug 12, 2003·6 cites·6 claims
- 3057US6339240B1Semiconductor memory deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jan 15, 2002·11 cites·34 claims
- 3157US5318925AMethod of manufacturing a self-aligned interlayer contact in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted Jun 7, 1994·26 cites·5 claims
- 3256US6376307B1Method for fabricating NOR type memory cells of nonvolatile memory deviceDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Apr 23, 2002·6 cites·6 claims
- 3356US5427980AMethod of making a contact of a semiconductor memory deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted Jun 27, 1995·20 cites·12 claims
- 3454US5989949AMethod of manufacturing a complementary metal-oxide semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1997·Granted Nov 23, 1999·15 cites·30 claims
- 3553US5510286AMethod for forming narrow contact holes of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1995·Granted Apr 23, 1996·19 cites·4 claims
- 3653US5270238AMethod of making a semiconductor memory device having a double-stacked capacitor structureHYUNDAI ELECTRONICS IND·Filed 1992·Granted Dec 14, 1993·13 cites·6 claims
- 3752US6372565B2Method of manufacturing SRAM cellHYUNDAI ELECTRONICS IND·Filed 2001·Granted Apr 16, 2002·5 cites·2 claims
- 3851US5270239AMethod for manufacturing a dynamic random access memory cellHYUNDAI ELECTRONICS IND·Filed 1992·Granted Dec 14, 1993·16 cites·6 claims
- 3951US5059548AMethod of making a semiconductor memory device having a double stacked capacitorHYUNDAI ELECTRONICS IND·Filed 1990·Granted Oct 22, 1991·14 cites·5 claims
- 4050US5461004AMethod for fabricating connection device with reduced area of highly integrated semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted Oct 24, 1995·19 cites·3 claims
- 4150US5332696AMethod for manufacturing a silicon layer having increased surface areaHYUNDAI ELECTRONICS IND·Filed 1993·Granted Jul 26, 1994·13 cites·7 claims
- 4249US6413816B2Method for forming memory cell of semiconductor memory deviceDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Jul 2, 2002·3 cites·6 claims
- 4349US5907502ASRAM cell and method of manufacturing the sameHYUNDAI ELECTRONICS IND·Filed 1997·Granted May 25, 1999·10 cites·9 claims
- 4449US5232876AMethod for manufacturing a silicon layer having increased surface areaHYUNDAI ELECTRONICS IND·Filed 1991·Granted Aug 3, 1993·12 cites·19 claims
- 4548US6281088B1Method of manufacturing SRAM having enhanced cell ratioHYUNDAI ELECTRONICS IND·Filed 1999·Granted Aug 28, 2001·9 cites·20 claims
- 4648US6204538B1SRAM cellHYUNDAI ELECTRONICS IND·Filed 1999·Granted Mar 20, 2001·10 cites·4 claims
- 4748US5358903AContact of a semiconductor device and its manufacturing processHYUNDAI ELECTRONICS IND·Filed 1993·Granted Oct 25, 1994·18 cites·6 claims
- 4847US5953603AMethod for manufacturing BiCMOSHYUNDAI ELECTRONICS IND·Filed 1998·Granted Sep 14, 1999·13 cites·18 claims
- 4947US5643832ASemiconductor device and method for fabrication thereofHYUNDAI ELECTRONICS IND·Filed 1995·Granted Jul 1, 1997·10 cites·5 claims
- 5047US5474950AMethod for manufacturing a capacitor in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted Dec 12, 1995·11 cites·5 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jae K. Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →