Inventor · disambiguated record
Jae Myun Kim
Also filed as: KIM JAE MYUN
11 granted patents·5 pending applications·284 citations·filing 1999–2015
90Inventor score
Top patents by PatentIndex Score
16 records- 0193US6380615B1Chip size stack package, memory module having the same, and method of fabricating the moduleHYUNDAI ELECTRONICS IND·Filed 2000·Granted Apr 30, 2002·95 cites·11 claims
- 0288US9064862B2Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packagesHWANG IN CHUL·Filed 2012·Granted Jun 23, 2015·9 cites·36 claims
- 0386US8390114B2Semiconductor packageKIM JAE MYUN·Filed 2010·Granted Mar 5, 2013·12 cites·12 claims
- 0486US6121682AMulti-chip packageHYUNDAI ELECTRONICS IND·Filed 1999·Granted Sep 19, 2000·96 cites·4 claims
- 0584US7989943B2Staircase shaped stacked semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Aug 2, 2011·15 cites·19 claims
- 0684US6380629B1Wafer level stack package and method of fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2000·Granted Apr 30, 2002·45 cites·9 claims
- 0777US7825504B2Semiconductor package and multi-chip semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Nov 2, 2010·8 cites·16 claims
- 0869US8492889B2Semiconductor packageSK HYNIX INC·Filed 2013·Granted Jul 23, 2013·2 cites·18 claims
- 0961US7759807B2Semiconductor package having structure for warpage preventionHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jul 20, 2010·2 cites·19 claims
- 1046US2013040425A1Spiral staircase shaped stacked semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 1145US2015249075A1Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packagesSK HYNIX INC·Filed 2015·Application pending·0 cites
- 1242US8242582B2Semiconductor package and stacked semiconductor package having the sameMIN BOK GYU·Filed 2009·Granted Aug 14, 2012·0 cites·18 claims
- 1340US2009065924A1Semiconductor package with reduced volume and signal transfer pathKIM JAE MYUN·Filed 2008·Application pending·0 cites
- 1439US2008054434A1Semiconductor stack package for optimal packaging of components having interconnectionsKIM JAE MYUN·Filed 2007·Application pending·0 cites
- 1538US8304879B2Spiral staircase shaped stacked semiconductor package and method for manufacturing the sameNAH DA UN·Filed 2010·Granted Nov 6, 2012·0 cites·14 claims
- 1631US2006284298A1Chip stack package having same length bonding leadsKIM JAE MYUN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →