Inventor · disambiguated record
Jae Choon Kim
Also filed as: KIM JAE CHOON
35 granted patents·18 pending applications·164 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
53 records- 0194US10198049B2Surface temperature management method of mobile device and memory thermal management method of multichip packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·9 cites·18 claims
- 0293US9671141B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 6, 2017·9 cites·20 claims
- 0393US9228763B2Thermoelectric cooling packages and thermal management methods thereofKIM JAE CHOON·Filed 2012·Granted Jan 5, 2016·18 cites·13 claims
- 0492US10546844B2Stack package and method of manufacturing the stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 28, 2020·15 cites·16 claims
- 0590US10707196B2Electronic device and method of manufacturing the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 7, 2020·9 cites·19 claims
- 0690US9606591B2Surface temperature management method of mobile device and memory thermal management method of multichip packageKWON HEUNGKYU·Filed 2012·Granted Mar 28, 2017·16 cites·7 claims
- 0789US10658266B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·3 cites·15 claims
- 0887US9653373B2Semiconductor package including heat spreader and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·7 cites·8 claims
- 0986US12125766B2Thermoelectric cooling packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 22, 2024·1 cites·20 claims
- 1085US10541263B2Image sensor package having multi-level stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 21, 2020·4 cites·15 claims
- 1184US10879294B2Image sensor package having multi-level stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 1284US9589842B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 7, 2017·5 cites·20 claims
- 1383US11107743B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·3 cites·16 claims
- 1483US8692349B2Semiconductor devices and methods of controlling temperature thereofKIM JAE CHOON·Filed 2011·Granted Apr 8, 2014·7 cites·35 claims
- 1582US10937771B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 1681US10347611B2Semiconductor packages having redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·4 cites·19 claims
- 1780US9991245B2Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the sameKIM JAE CHOON·Filed 2015·Granted Jun 5, 2018·4 cites·10 claims
- 1879US9030826B2Chip-on-film packages and device assemblies including the sameKIM JICHUL·Filed 2012·Granted May 12, 2015·6 cites·17 claims
- 1977US10510737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·12 claims
- 2075US10790213B2Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·2 cites·20 claims
- 2174US11205604B2Semiconductor package including a thermal conductive layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 21, 2021·2 cites·16 claims
- 2272US10985152B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 2371US9588577B2Electronic systems including heterogeneous multi-core processors and methods of operating sameAHN MIN SEON·Filed 2014·Granted Mar 7, 2017·7 cites·10 claims
- 2469US11502059B2Semiconductor package including a thermal pillar and heat transfer filmSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 15, 2022·1 cites·20 claims
- 2568US11600608B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2668US10553513B2Chip structure including heating elementSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 4, 2020·1 cites·17 claims
- 2766US10879225B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·1 cites·22 claims
- 2864US9704815B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 11, 2017·1 cites·18 claims
- 2963US11756850B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 3063US5809951AApparatus for opening and shutting valves of an engineKIA MOTORS CORP·Filed 1996·Granted Sep 22, 1998·18 cites·6 claims
- 3162US9651431B2Semiconductor package and method of estimating surface temperature of semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 16, 2017·2 cites·14 claims
- 3261US12469764B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 3361US2024413053A1Heat radiation devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3461US2024413038A1Stacked semiconductor package and lower semiconductor package used for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3561US2025015049A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3660US2025305773A1Vapor chamber and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3760US2025079338A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3859US2025062279A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3957US11004760B2Chip structure operating method including heating elements to reduce temperature variationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 4057US2024321673A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4157US2024321669A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4255US2025236775A1Composite structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4355US2024072020A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4454US2024119211A1Semiconductor design optimization systems and methods of operation thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4553US12142544B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 4646US2014184312A1Semiconductor devices and methods of controlling temperature thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4743US9679874B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·0 cites·12 claims
- 4842US2014324245A1Application processor and dynamic thermal management method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4942US2014136827A1Mobile device and data communication method of semiconductor integrated circuit of mobile deviceCHO EUNSEOK·Filed 2013·Application pending·0 cites
- 5039US2013166093A1Electronic device and temperature control method thereofKIM JAE CHOON·Filed 2012·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →