Inventor · disambiguated record
Jaechoon Kim
Also filed as: KIM JAECHOON
9 granted patents·17 pending applications·15 citations·filing 2013–2025
80Inventor score
Files withSAMSUNG ELECTRONICS CO LTD26
Top patents by PatentIndex Score
26 records- 0191US12009303B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·5 cites·20 claims
- 0281US8988115B2Electronic device and method for controlling temperature thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·10 cites·19 claims
- 0376US12237268B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 0475US2025096061A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0569US12243803B2Thermal interface material, method of manufacturing the same, and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 0668US12506047B2Semiconductor package and cooling systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·19 claims
- 0766US12199002B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·15 claims
- 0866US2025157930A1Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0963US2025140695A1Semiconductor package with a backside power distribution networkSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1060US2024321841A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2024332150A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1259US2025261339A1Heat dissipating deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1358US11935812B2Thermal interface material and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 1458US2024321681A1Heat dissipation structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1557US12388048B2Semiconductor package comprising heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1657US2024321682A1Heat dissipation structuresSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1756US2024321679A1Heat dissipation structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1856US2024055339A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024079366A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2054US2024014166A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2153US2024145360A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2253US2023307318A1Semiconductor package and cooling system thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2352US2024170366A1Semiconductor package with a heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2452US2024186290A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2550US12431403B2Semiconductor package including thermal interface material (TIM) layers on semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·16 claims
- 2650US2023178450A1Film packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →