Inventor · disambiguated record
Jae Woon Kim
Also filed as: KIM JAE WOON
12 granted patents·4 pending applications·139 citations·filing 1995–2023
91Inventor score
Files withHYUNDAI ELECTRONICS IND5LG SEMICON CO LTD3SAMSUNG ELECTRONICS CO LTD23D TRANSFER PAPER DEV CO LTD1HYNIX SEMICONDUCTOR INC1
Top patents by PatentIndex Score
16 records- 0183US9082475B2Nonvolatile memory deviceMAGNACHIP SEMICONDUCTOR LTD·Filed 2012·Granted Jul 14, 2015·9 cites·26 claims
- 0273US6159826ASemiconductor wafer and fabrication method of a semiconductor chipHYUNDAI ELECTRONICS IND·Filed 1998·Granted Dec 12, 2000·39 cites·10 claims
- 0369US6442716B1Data output bufferHYUNDAI ELECTRONICS IND·Filed 2000·Granted Aug 27, 2002·18 cites·19 claims
- 0469US2025201897A1Electrode Lead Alignment Appartus for Battery ManufacturingLG ENERGY SOLUTION LTD·Filed 2023·Application pending·0 cites
- 0565US5654664AInput buffer circuit for a semiconductor memoryLG SEMICON CO LTD·Filed 1996·Granted Aug 5, 1997·20 cites·17 claims
- 0661US5682113APulse extending circuitLG SEMICON CO LTD·Filed 1995·Granted Oct 28, 1997·17 cites·15 claims
- 0760US6531709B1Semiconductor wafer and fabrication method of a semiconductor chipHYUNDAI ELECTRONICS IND·Filed 2000·Granted Mar 11, 2003·8 cites·13 claims
- 0854US12500079B2Semiconductor device manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 0954US6314038B1Semiconductor memory device for reducing parasitic resistance of the I/O linesHYUNDAI ELECTRONICS IND·Filed 2001·Granted Nov 6, 2001·8 cites·17 claims
- 1053US2011081522A1Three-dimensional foaming type transfer paper with enhanced durability and method for manufacturing the same3D TRANSFER PAPER DEV CO LTD·Filed 2008·Application pending·0 cites
- 1151US2023220213A1Compositions for manufacturing thin film and methods for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1248US6259649B1Semiconductor memory circuit layout capable of reducing the number of wiresHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jul 10, 2001·6 cites·8 claims
- 1347US6225820B1Semiconductor device having improved input buffer circuitHYUNDAI MICRO ELECTRONICS CO·Filed 1999·Granted May 1, 2001·9 cites·19 claims
- 1441US2021166791A1Apparatus and method for constructing library for deriving material compositionKOREA ADVACNED INSTITUTE OF SCIENCE AND TECH·Filed 2019·Application pending·0 cites
- 1539US5923069AVoltage level detecting circuitLG SEMICON CO LTD·Filed 1997·Granted Jul 13, 1999·5 cites·20 claims
- 1632US6721209B2Semiconductor memory deviceHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Apr 13, 2004·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →