Inventor · disambiguated record
Ja Chun Ku
Also filed as: KU JA CHUN
13 granted patents·3 pending applications·64 citations·filing 1999–2014
88Inventor score
Top patents by PatentIndex Score
16 records- 0187US8349636B2Method of manufacturing a phase change memory device using a cross patterning techniqueHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Jan 8, 2013·10 cites·13 claims
- 0282US7763523B2Method for forming device isolation structure of semiconductor device using annealing steps to anneal flowable insulation layerHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Jul 27, 2010·8 cites·16 claims
- 0373US8982604B2Resistive memory device and memory apparatus and data processing system having the sameSK HYNIX INC·Filed 2013·Granted Mar 17, 2015·5 cites·39 claims
- 0470US9520186B2Electronic deviceSK HYNIX INC·Filed 2014·Granted Dec 13, 2016·3 cites·22 claims
- 0570US8530330B2Method for manufacturing a semiconductor device capable of preventing the decrease of the width of an active regionAHN SANG TAE·Filed 2008·Granted Sep 10, 2013·5 cites·20 claims
- 0669US8344346B2Semiconductor device having resistive deviceHYNIX SEMICONDUCTOR INC·Filed 2011·Granted Jan 1, 2013·2 cites·15 claims
- 0762US6316349B1Method for forming contacts of semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 13, 2001·31 cites·17 claims
- 0853US9153446B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted Oct 6, 2015·0 cites·19 claims
- 0953US8354350B2Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Granted Jan 15, 2013·0 cites·7 claims
- 1050US8736017B2Semiconductor device and method for fabricating the sameJANG SE-AUG·Filed 2009·Granted May 27, 2014·0 cites·16 claims
- 1150US8202807B2Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the sameMIN SUNG KYU·Filed 2007·Granted Jun 19, 2012·0 cites·4 claims
- 1249US8507665B2Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the sameMIN SUNG KYU·Filed 2012·Granted Aug 13, 2013·0 cites·10 claims
- 1346US2010261355A1Method for forming a high quality insulation layer on a semiconductor deviceAHN SANG TAE·Filed 2009·Application pending·0 cites
- 1445US2009061622A1Method for manufacturing semiconductor device capable of preventing lifting of amorphous carbon layer for hard maskAHN SANG TAE·Filed 2008·Application pending·0 cites
- 1542US2008120514A1Thermal management of on-chip caches through power density minimizationISMAIL YEHEA·Filed 2007·Application pending·0 cites
- 1641US9105840B2Electronic device and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted Aug 11, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →