Inventor · disambiguated record
Jang Kuk Kwon
Also filed as: KWON JANG KUK
7 granted patents·4 pending applications·1 citations·filing 2015–2022
68Inventor score
Technology areasH10P
Top patents by PatentIndex Score
11 records- 0162US10494547B2Additive composition and positive polishing slurry composition including the sameKCTECH CO LTD·Filed 2016·Granted Dec 3, 2019·1 cites·9 claims
- 0259US12116503B2Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 0349US12486428B2Polishing pad and method for manufacturing semiconductor device using sameSK ENPULSE CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·13 claims
- 0448US2022325139A1Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 0547US12444616B2Polishing composition for semiconductor processing polishing composition preparation method, and semiconductor device manufacturing method to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·10 claims
- 0646US2023332014A1Polishing compostion for semiconductor process, manufacturing method of polishing composition and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 0746US2024043718A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 0845US2024043719A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSKC ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 0941US10138395B2Abrasive particle-dispersion layer composite and polishing slurry composition including the sameK C TECH CO LTD·Filed 2016·Granted Nov 27, 2018·0 cites·15 claims
- 1033US10421883B2Abrasive particle-dispersion layer composite and polishing slurry composition including the sameKCTECH CO LTD·Filed 2016·Granted Sep 24, 2019·0 cites·14 claims
- 1128US10428240B2Method for preparing slurry composition and slurry composition prepared therebyKCTECH CO LTD·Filed 2015·Granted Oct 1, 2019·0 cites·26 claims
Join the waitlist — get patent alerts
Get an alert when Jang Kuk Kwon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →