Inventor · disambiguated record
Jae Jin Kwon
Also filed as: KWON JAE JIN
3 granted patents·2 pending applications·0 citations·filing 2017–2021
45Inventor score
Top patents by PatentIndex Score
5 records- 0157US11664297B2Manufacturing method for reflowed solder balls and their under bump metallurgy structureLBSEMICON CO LTD·Filed 2021·Granted May 30, 2023·0 cites·3 claims
- 0241US11127658B2Manufacturing method for reflowed solder balls and their under bump metallurgy structureLBSEMICON CO LTD·Filed 2017·Granted Sep 21, 2021·0 cites·8 claims
- 0338US2020168506A1Methods of fabricating semiconductor packageLBSEMICON INC·Filed 2019·Application pending·0 cites
- 0438US2020168477A1Methods of fabricating semiconductor packageLBSEMICON INC·Filed 2019·Application pending·0 cites
- 0531US10825788B2Method for manufacturing compliant bumpLBSEMICON CO LTD·Filed 2017·Granted Nov 3, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →