Inventor · disambiguated record
Jae-Wung Lee
Also filed as: LEE JAE-WUNG
3 granted patents·5 pending applications·2 citations·filing 2013–2022
50Inventor score
Top patents by PatentIndex Score
8 records- 0168US9505612B2Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereofAGENCY SCIENCE TECH & RES·Filed 2014·Granted Nov 29, 2016·2 cites·11 claims
- 0245US12209012B2Wafer level package for deviceTEKNOLOGIAN TUTKIMUSKESKUS VTT OY·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 0344US2024391762A1Packaging of microelectromechanical system devicesTEKNOLOGIAN TUTKIMUSKESKUS VTT OY·Filed 2022·Application pending·0 cites
- 0441US2024312955A1Bonding StructureTEKNOLOGIAN TUTKIMUSKESKUS VTT OY·Filed 2022·Application pending·0 cites
- 0540US10669152B2Device arrangementAGENCY SCIENCE TECH & RES·Filed 2016·Granted Jun 2, 2020·0 cites·20 claims
- 0639US2023382721A1Wafer level package for deviceTEKNOLOGIAN TUTKIMUSKESKUS VTT OY·Filed 2021·Application pending·0 cites
- 0737US2016289064A1Thin Film Encapsulation of ElectrodesAGENCY SCIENCE TECH & RES·Filed 2014·Application pending·0 cites
- 0834US2014147955A1Method of encapsulating a micro-electromechanical (mems) deviceLEE JAE-WUNG·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jae-Wung Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →