Inventor · disambiguated record
Jae Hwi Lee
Also filed as: LEE JAE HWI
0 granted patents·2 pending applications·0 citations·filing 2013–2022
Top patents by PatentIndex Score
2 records- 0159US2023201992A1Method of polishing a substrate having deposited amorphous carbon layerDONGJIN SEMICHEM CO LTD·Filed 2022·Application pending·0 cites
- 0231US2015224221A1Method for preparing microspheres for emboli, and method for preparing microspheres to which drug-containing carrier is boundUNIV CHUNG ANG IND·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →