Inventor · disambiguated record
Jaeean Lee
Also filed as: LEE JAEEAN
6 granted patents·9 pending applications·8 citations·filing 2019–2025
72Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0191US11990439B2Semiconductor package including under bump metallization padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·4 cites·15 claims
- 0283US11088115B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·19 claims
- 0376US2025140755A1Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0468US12489060B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0564US12218099B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·16 claims
- 0659US2025079317A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025125247A1Panel-level packaged (plp) integrated circuits and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025015043A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0958US2025079382A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1057US2025062252A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2024304557A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1255US2024347487A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1353US12469775B2Semiconductor package including substrate having a dummy pattern between padsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 1447US11417595B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·18 claims
- 1546US2025379172A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →