Inventor · disambiguated record
Jae Ean Lee
Also filed as: LEE JAE-EAN
15 granted patents·15 pending applications·49 citations·filing 2014–2024
90Inventor score
Top patents by PatentIndex Score
30 records- 0196US10665535B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 26, 2020·17 cites·22 claims
- 0288US11189552B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 0388US9999131B2Printed circuit board with embedded electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·6 cites·11 claims
- 0486US10325856B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 18, 2019·4 cites·15 claims
- 0584US10297553B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted May 21, 2019·3 cites·14 claims
- 0683US10438884B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·3 cites·14 claims
- 0781US10916495B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·3 cites·16 claims
- 0881US10306778B2Printed circuit board with dam around cavity and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted May 28, 2019·3 cites·20 claims
- 0978US10045444B2Printed circuit board, package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 7, 2018·3 cites·18 claims
- 1074US10636743B2Electronic component package and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 28, 2020·1 cites·16 claims
- 1173US10796997B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·17 claims
- 1271US10790224B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·1 cites·18 claims
- 1370US2024266269A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1467US11699643B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·12 claims
- 1564US11978696B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1664US9848492B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 19, 2017·1 cites·4 claims
- 1757US2024404936A1Stacked structure including conductive pattern for self-alignmentSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1855US2024387486A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1954US2025046728A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2051US2015251278A1Solder ball and circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2151US2024071895A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2251US2015143694A1Carrier for manufacturing printed circuit board and manufacturing method thereof, and method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2342US2023134541A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2439US2019229070A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 2537US2016374196A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2637US2016381792A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2736US2017079142A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2834US2016037645A1Embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2934US2015342054A1Embedded coreless substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3034US2016021744A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →