Inventor · disambiguated record
Janggeun Lee
Also filed as: LEE JANGGEUN
2 granted patents·7 pending applications·1 citations·filing 2016–2023
30Inventor score
Top patents by PatentIndex Score
9 records- 0156US12347774B2Integrated circuit devices including metal lines spaced apart from metal vias, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·18 claims
- 0253US2025022797A1Interconnect structure including metal line and top via formed through different processesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0348US2023343698A1Interconnect structure of semiconductor device including metal pattern or via structure with sidewall spacer structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0448US2023369111A1Integrated circuit devices including metal structures having a curved interface and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0547US2023361032A1Wet recess for ru subtractive processSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0647US2023352399A1Integrated circuit devices including a via and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0746US2023343697A1Semiconductor device including spacer via structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0846US2023253327A1Hybrid super via structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0945US10778956B2Experience sharing system comprising smart glasses and virtual reality or smartphone deviceLEE JANGGEUN·Filed 2016·Granted Sep 15, 2020·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →