Inventor · disambiguated record
Jaesic Lee
Also filed as: LEE JAESIC
7 granted patents·10 pending applications·2 citations·filing 2017–2025
71Inventor score
Top patents by PatentIndex Score
17 records- 0192US12225792B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Feb 11, 2025·2 cites·23 claims
- 0272US12437724B2Scan driverSAMSUNG DISPLAY CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·30 claims
- 0367US11972736B2Scan driverSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 0464US11631729B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·24 claims
- 0564US2025318383A1Display apparatus and electronic apparatus including the display apparatusSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0659US2025087646A1Semiconductor package including backside power delivery network layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025006625A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US2025022787A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0959US2025046757A1Semiconductor package including conductive posts and a heat spreader and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1058US2025233095A1Semiconductor chip, semiconductor package including semiconductor chip, and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1158US2025149466A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1257US2025029913A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1357US2025167147A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1456US12300184B2Display apparatus including multiple demultiplexersSAMSUNG DISPLAY CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1556US2025022843A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1649US12446416B2Organic light-emitting diode display apparatus including first and second initialization connection lines maintaining initialization voltagesSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·27 claims
- 1740US10672325B2Light emitting display deviceSAMSUNG DISPLAY CO LTD·Filed 2017·Granted Jun 2, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →