Inventor · disambiguated record
Jaekul Lee
Also filed as: LEE JAEKUL
9 granted patents·4 pending applications·99 citations·filing 2013–2024
83Inventor score
Top patents by PatentIndex Score
13 records- 0194US9800717B2Mobile terminal and method for controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Oct 24, 2017·91 cites·23 claims
- 0291US11967578B2Semiconductor package including postSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 23, 2024·2 cites·20 claims
- 0376US11121079B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 0474US12322720B2Semiconductor package including postSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 0574US10029723B2Input system disposed in steering wheel and vehicle including the sameLG ELECTRONICS INC·Filed 2015·Granted Jul 24, 2018·4 cites·20 claims
- 0669US12154840B2Semiconductor device and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0763US11837537B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 0863US11670568B2Semiconductor device and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·18 claims
- 0959US2024395747A1Semiconductor package and method of inspecting the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1057US2024142493A1Socket for testing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1147US11088060B2Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·18 claims
- 1242US2016110094A1Mobile terminal and control method thereofLG ELECTRONICS INC·Filed 2013·Application pending·0 cites
- 1334US2017094188A1Camera module and mobile terminal communicating with the sameLG ELECTRONICS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →