Inventor · disambiguated record
Jade Sharee Lewis
Also filed as: LEWIS JADE SHAREE
0 granted patents·3 pending applications·0 citations·filing 2022–2023
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0153US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0242US2024203664A1In core large area capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 0341US2024153857A1High aspect ratio tgv substrates through direct hybrid bonding of thin tgv substratesINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →