Inventor · disambiguated record
Jangshen Lin
Also filed as: LIN JANGSHEN
29 granted patents·9 citations·filing 2017–2022
92Inventor score
Files withSJ SEMICONDUCTOR JIANGYIN CORP29
Top patents by PatentIndex Score
29 records- 0182US11211687B2Method of fabricating a semiconductor structure with an antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 28, 2021·3 cites·5 claims
- 0275US10714435B2Fan-out antenna packaging structure and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jul 14, 2020·2 cites·11 claims
- 0374US10777876B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 15, 2020·1 cites·4 claims
- 0473US10325786B1Double-sided plastic fan-out package structure having antenna and manufacturing method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jun 18, 2019·2 cites·9 claims
- 0570US11502392B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Nov 15, 2022·0 cites·9 claims
- 0668US11437707B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 0768US10770394B2Fan-out semiconductor packaging structure with antenna module and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 8, 2020·1 cites·15 claims
- 0867US11699840B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 0964US11728558B2Semiconductor structure including antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Aug 15, 2023·0 cites·9 claims
- 1063US11488915B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·8 claims
- 1161US11283152B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 22, 2022·0 cites·9 claims
- 1260US10886594B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1359US11257772B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Feb 22, 2022·0 cites·9 claims
- 1457US10886243B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·5 claims
- 1554US12482759B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Nov 25, 2025·0 cites·5 claims
- 1654US11114391B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 7, 2021·0 cites·9 claims
- 1754US10573609B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Feb 25, 2020·0 cites·6 claims
- 1853US11228087B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 18, 2022·0 cites·10 claims
- 1953US10854951B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Dec 1, 2020·0 cites·11 claims
- 2052US12512411B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Dec 30, 2025·0 cites·4 claims
- 2152US11322852B2Lens antenna packaging structure, preparation method and electronic deviceSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 2251US12198942B2Packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Jan 14, 2025·0 cites·10 claims
- 2351US10777515B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 15, 2020·0 cites·9 claims
- 2450US11289793B2Semiconductor packaging structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Mar 29, 2022·0 cites·11 claims
- 2543US11316247B2Semiconductor packaging structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 2642US11515269B2Semiconductor packaging structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Nov 29, 2022·0 cites·13 claims
- 2739US10872867B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 22, 2020·0 cites·5 claims
- 2839US10872868B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 22, 2020·0 cites·5 claims
- 2938US10636779B2Packaging device for integrated power supply system and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2017·Granted Apr 28, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →