Inventor · disambiguated record
Jacob R. Mauermann
Also filed as: MAUERMANN JACOB R
6 granted patents·6 pending applications·1 citations·filing 2020–2023
65Inventor score
Top patents by PatentIndex Score
12 records- 0180US11948855B1Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreaderROCKWELL COLLINS INC·Filed 2022·Granted Apr 2, 2024·1 cites·7 claims
- 0259US11326246B2Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film depositionROCKWELL COLLINS INC·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 0355US2025071911A1Anisotropic conductive substrates and methods of useBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 0450US11236436B2Controlled induced warping of electronic substrates via electroplatingROCKWELL COLLINS INC·Filed 2020·Granted Feb 1, 2022·0 cites·14 claims
- 0550US2024339365A1Resilient conductive bump for microelectronic testingBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 0649US11515225B2Reconstituted wafer including mold material with recessed conductive featureROCKWELL COLLINS INC·Filed 2020·Granted Nov 29, 2022·0 cites·18 claims
- 0749US2024413111A1Inline resistor integrated with conductive contact pad structureBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 0848US11239182B2Controlled induced warping of electronic substratesROCKWELL COLLINS INC·Filed 2020·Granted Feb 1, 2022·0 cites·12 claims
- 0948US2025006779A1Capacitor structure integrated with contact pad structureBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 1047US11605570B2Reconstituted wafer including integrated circuit die mechanically interlocked with mold materialROCKWELL COLLINS INC·Filed 2020·Granted Mar 14, 2023·0 cites·12 claims
- 1143US2023163041A1Selective heat sinkBAE SYS INF & ELECT SYS INTEG·Filed 2021·Application pending·0 cites
- 1243US2023163040A1Die level cavity heat sinkBAE SYS INF & ELECT SYS INTEG·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →