Inventor · disambiguated record
Jay Meyer
Also filed as: MEYER JAY · MEYER JAY A
1 granted patent·2 pending applications·70 citations·filing 1990–2006
50Inventor score
Top patents by PatentIndex Score
3 records- 0182US5018982AAdapter for stacking printed circuit boardsNCR CO·Filed 1990·Granted May 28, 1991·70 cites·3 claims
- 0244US2007020920A1Method for fabricating low leakage interconnect layers in integrated circuitsPALSULE CHINTAMANI·Filed 2006·Application pending·0 cites
- 0338US2006099800A1Method for fabricating low leakage interconnect layers in integrated circuitsPALSULE CHINTAMANI·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jay Meyer files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →