Inventor · disambiguated record
Jason G. Milne
Also filed as: MILNE JASON G
16 granted patents·2 pending applications·92 citations·filing 2007–2025
92Inventor score
Top patents by PatentIndex Score
18 records- 0194US10446466B1Mechanically improved microelectronic thermal interface structure for low die stressRAYTHEON CO·Filed 2018·Granted Oct 15, 2019·15 cites·20 claims
- 0293US9502330B1Coolant distribution structure for monolithic microwave integrated circuits (MMICs)RAYTHEON CO·Filed 2015·Granted Nov 22, 2016·12 cites·18 claims
- 0391US9960101B2Micro-hoses for integrated circuit and device level coolingRAYTHEON CO·Filed 2016·Granted May 1, 2018·9 cites·20 claims
- 0490US8921992B2Stacked wafer with coolant channelsRAYTHEON CO·Filed 2013·Granted Dec 30, 2014·13 cites·9 claims
- 0587US8648759B2Variable height radiating apertureWANG ALLEN·Filed 2011·Granted Feb 11, 2014·12 cites·15 claims
- 0686US10541461B2Tile for an active electronically scanned array (AESA)RAYTHEON CO·Filed 2016·Granted Jan 21, 2020·6 cites·19 claims
- 0786US10242967B2Die encapsulation in oxide bonded wafer stackRAYTHEON CO·Filed 2017·Granted Mar 26, 2019·4 cites·22 claims
- 0885US10581177B2High frequency polymer on metal radiatorRAYTHEON CO·Filed 2016·Granted Mar 3, 2020·7 cites·20 claims
- 0974US7631414B2Methods for producing large flat panel and conformal active array antennasRAYTHEON CO·Filed 2007·Granted Dec 15, 2009·7 cites·13 claims
- 1067US2025324547A1Flexible heat exchange deviceRAYTHEON CO·Filed 2025·Application pending·0 cites
- 1165US8653673B2Method for packaging semiconductors at a wafer levelHALLOCK ROBERT B·Filed 2011·Granted Feb 18, 2014·3 cites·20 claims
- 1264US9893430B2Short coincident phased slot-fed dual polarized apertureRAYTHEON CO·Filed 2013·Granted Feb 13, 2018·2 cites·20 claims
- 1359US10784234B2Die encapsulation in oxide bonded wafer stackRAYTHEON CO·Filed 2019·Granted Sep 22, 2020·0 cites·9 claims
- 1455US8982931B2RF puckRAYTHEON CO·Filed 2013·Granted Mar 17, 2015·1 cites·20 claims
- 1551US9218989B2Aerogel dielectric layerHAUHE MARK S·Filed 2011·Granted Dec 22, 2015·1 cites·23 claims
- 1644US11688700B2Die package having security featuresRAYTHEON CO·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 1743US2015380343A1Flip chip mmic having mounting stiffenerRAYTHEON CO·Filed 2014·Application pending·0 cites
- 1838US8209846B2Methods for producing large flat panel and conformal active array antennasQUIL AVERY Y·Filed 2009·Granted Jul 3, 2012·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →