Inventor · disambiguated record
James J. Murphy
Also filed as: MURPHY JAMES · MURPHY JAMES J · MURPHY JAMES JOHN
26 granted patents·2 pending applications·721 citations·filing 1989–2018
97Inventor score
Top patents by PatentIndex Score
28 records- 0197US8143124B2Methods of making power semiconductor devices with thick bottom oxide layerCHALLA ASHOK·Filed 2008·Granted Mar 27, 2012·148 cites·6 claims
- 0295US7936009B2Shielded gate trench FET with an inter-electrode dielectric having a low-k dielectric thereinFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted May 3, 2011·35 cites·23 claims
- 0395US6444528B1Selective oxide deposition in the bottom of a trenchFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted Sep 3, 2002·99 cites·21 claims
- 0493US8329538B2Shielded gate trench FET with an inter-electrode dielectric having a low-k dielectric thereinPAN JAMES·Filed 2011·Granted Dec 11, 2012·15 cites·16 claims
- 0592US7078296B2Self-aligned trench MOSFETs and methods for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Jul 18, 2006·69 cites·24 claims
- 0690US8936985B2Methods related to power semiconductor devices with thick bottom oxide layersCHALLA ASHOK·Filed 2012·Granted Jan 20, 2015·6 cites·12 claims
- 0790US5478435APoint of use slurry dispensing systemNAT SEMICONDUCTOR CORP·Filed 1994·Granted Dec 26, 1995·161 cites·16 claims
- 0889US6437386B1Method for creating thick oxide on the bottom surface of a trench structure in siliconFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·59 cites·6 claims
- 0985USD343916SHeadlamp with hexagonal faceted reflectorGTE PROD CORP·Filed 1991·Granted Feb 1, 1994·27 cites·1 claims
- 1084US7768075B2Semiconductor die packages using thin dies and metal substratesFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Aug 3, 2010·12 cites·9 claims
- 1184US6861296B2Method for creating thick oxide on the bottom surface of a trench structure in siliconFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Mar 1, 2005·36 cites·23 claims
- 1279US8058732B2Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2008·Granted Nov 15, 2011·10 cites·33 claims
- 1373US8198196B1High aspect ratio trench structures with void-free fill materialMURPHY JAMES J·Filed 2011·Granted Jun 12, 2012·5 cites·12 claims
- 1473US7960800B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 14, 2011·5 cites·13 claims
- 1572US8598035B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 1670US8343852B2Method and structure for dividing a substrate into individual devicesFAIRCHILD SEMICONDUCTOR·Filed 2011·Granted Jan 1, 2013·2 cites·15 claims
- 1767US8329508B2Semiconductor die packages using thin dies and metal substratesYILMAZ HAMZA·Filed 2010·Granted Dec 11, 2012·2 cites·22 claims
- 1865US8143125B2Structure and method for forming a salicide on the gate electrode of a trench-gate FETPURTELL ROBERT J·Filed 2009·Granted Mar 27, 2012·3 cites·19 claims
- 1962US7951688B2Method and structure for dividing a substrate into individual devicesFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted May 31, 2011·1 cites·8 claims
- 2060US8158506B2Methods and designs for localized wafer thinningKIM SUKU·Filed 2008·Granted Apr 17, 2012·2 cites·18 claims
- 2160US7956411B2High aspect ratio trench structures with void-free fill materialFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Jun 7, 2011·2 cites·19 claims
- 2259US5055343APatterned metallized film and method for making sameAMERICAN DECAL & MFG·Filed 1989·Granted Oct 8, 1991·18 cites·23 claims
- 2356US8129778B2Semiconductor devices and methods for making the sameKIM SUKU·Filed 2009·Granted Mar 6, 2012·1 cites·20 claims
- 2449US9651527B2Ring shaped counter electrode to improve beam stability and compound sensitivity on a ceramic tile type microfluidic deviceMICROMASS LTD·Filed 2015·Granted May 16, 2017·0 cites·15 claims
- 2547US8624393B2Methods and designs for localized wafer thinningKIM SUKU·Filed 2012·Granted Jan 7, 2014·0 cites·19 claims
- 2643US2011006409A1Nickel-titanum contact layers in semiconductor devicesGRUENHAGEN MICHAEL D·Filed 2009·Application pending·0 cites
- 2741US2011031596A1Nickel-titanum soldering layers in semiconductor devicesGRUENHAGEN MIKE D·Filed 2009·Application pending·0 cites
- 2832US11472118B2System and method of manufacturing a mouth pieceGABAJA LTD·Filed 2018·Granted Oct 18, 2022·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when James J. Murphy files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →