Inventor · disambiguated record
James Kent Naylor
Also filed as: NAYLOR JAMES · NAYLOR JAMES K · NAYLOR JAMES KENT
6 granted patents·8 pending applications·7 citations·filing 1999–2025
71Inventor score
Files withDEPUY IRELAND ULTD CO5HZO INC3DEPUY SYNTHES PRODUCTS INC2LANG DENNIS2SREEKANTHAM SREEVATSA1
Top patents by PatentIndex Score
14 records- 0174US11060183B2Apparatuses, systems and methods for applying protective coatings to electronic device assembliesHZO INC·Filed 2013·Granted Jul 13, 2021·5 cites·21 claims
- 0264US2025295420A1Adjustable reamer driver and impactor, and methods of preparing said driver and impactorDEPUY IRELAND ULTD CO·Filed 2025·Application pending·0 cites
- 0363US2024423650A1Combination drill guide and depth gauge surgical instrument for implanting an acetabular cup component and associated surgical methodDEPUY SYNTHES PRODUCTS INC·Filed 2024·Application pending·0 cites
- 0460US2020208258A1Apparatuses, systems and methods for protecting electronic device assembliesHZO INC·Filed 2020·Application pending·0 cites
- 0558US8592277B2Method of forming low resistance gate for power MOSFET applicationsSREEKANTHAM SREEVATSA·Filed 2010·Granted Nov 26, 2013·2 cites·25 claims
- 0657US2013286567A1Apparatuses, systems and methods for protecting electronic device assembliesHZO INC·Filed 2013·Application pending·0 cites
- 0754US12082828B2Combination drill guide and depth gauge surgical instrument for implanting an acetabular cup component and associated surgical methodDEPUY SYNTHES PRODUCTS INC·Filed 2021·Granted Sep 10, 2024·0 cites·15 claims
- 0852US12324595B2Adjustable reamer driver and impactor, and methods of preparing said driver and impactorDEPUY IRELAND ULTD CO·Filed 2020·Granted Jun 10, 2025·0 cites·9 claims
- 0943US12279780B2Assemblies and kits for reaming orthopedic joints, and method of assembling reamer for saidDEPUY IRELAND ULTD CO·Filed 2020·Granted Apr 22, 2025·0 cites·8 claims
- 1042US2008054461A1Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor deviceLANG DENNIS·Filed 2007·Application pending·0 cites
- 1139US2022409219A1Assemblies and kits for reaming, methods of assembling reamers and use thereof in reaming an orthopedic jointDEPUY IRELAND ULTD CO·Filed 2020·Application pending·0 cites
- 1234US2010117231A1Reliable wafer-level chip-scale solder bump structureLANG DENNIS·Filed 2010·Application pending·0 cites
- 1332USD1042174SDepth gaugeDEPUY IRELAND ULTD CO·Filed 2022·Granted Sep 17, 2024·0 cites·1 claims
- 1422US2001001733A1Improved method for selectively etching a semiconductor deviceFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →