Inventor · disambiguated record
Jaehyung Park
Also filed as: PARK JAEHYUNG
20 granted patents·15 pending applications·265 citations·filing 2002–2025
94Inventor score
Top patents by PatentIndex Score
35 records- 0198US8614293B2Concentrated aqueous silk fibroin solution and use thereofKAPLAN DAVID L·Filed 2009·Granted Dec 24, 2013·40 cites·20 claims
- 0298US7635755B2Concentrated aqueous silk fibroin solution and use thereofTUFTS COLLEGE·Filed 2005·Granted Dec 22, 2009·176 cites·11 claims
- 0397US8742069B2Concentrated aqueous silk fibroin solution and use thereofTUFTS COLLEGE·Filed 2013·Granted Jun 3, 2014·22 cites·5 claims
- 0495US10314938B2Concentrated aqueous silk fibroin solution and use thereofTUFTS COLLEGE·Filed 2017·Granted Jun 11, 2019·3 cites·18 claims
- 0595US9084840B2Concentrated aqueous silk fibroin solution and use thereofKAPLAN DAVID L·Filed 2009·Granted Jul 21, 2015·12 cites·12 claims
- 0692US12142588B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·1 cites·19 claims
- 0792US11129921B2Concentrated aqueous silk fibroin solution and use thereofTUFTS COLLEGE·Filed 2019·Granted Sep 28, 2021·1 cites·9 claims
- 0890US11362067B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0986US12136602B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·16 claims
- 1084US9623147B2Concentrated aqueous silk fibroin solution and use thereofTUFTS COLLEGE·Filed 2014·Granted Apr 18, 2017·1 cites·10 claims
- 1183US2025038141A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1282US2022054704A1Concentrated aqueous silk fibroin solution and use thereofTUFTS COLLEGE·Filed 2021·Application pending·0 cites
- 1380US11152317B2Semiconductor device including interconnection structure including copper and tin and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·17 claims
- 1479US11348892B2Semiconductor devices including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·1 cites·19 claims
- 1579US2025022823A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1674US11616036B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
- 1774US11360626B2Display including touch-sensitive circuit and method for operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·1 cites·17 claims
- 1868US11296045B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·18 claims
- 1967US2013165004A1Concentrated aqueous silk fibroin solution and use thereofKAPLAN DAVID L·Filed 2013·Application pending·0 cites
- 2065US11824035B2Method of manufacturing a semiconductor device including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·18 claims
- 2165US10860146B2Electronic device having a plurality of piezoelectric elementsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 8, 2020·1 cites·17 claims
- 2262US2025348118A1Electronic device comprising flexible display and method for identifying folded state or unfolded stateSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2359US2024051859A1Apparatus and method for treating waste waterSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2456US2024032287A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2555US2024081045A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2654US2024049445A1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2753US2024071841A1Layout method of semiconductor, inspection method of wafer, manufacturing method of the wafer and manufacturing method of multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2850US11658139B2Semiconductor package for improving bonding reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2948US11887841B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 3047US2020377096A1System and method for controlling creep running of vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Application pending·0 cites
- 3145US2014098048A1Method and apparatus for enhancing performance of touch screenSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3243US2013135231A1Touch screen and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 3341US11023571B2Method for registering and authenticating biometric data and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 1, 2021·0 cites·12 claims
- 3439US2003101276A1Parallel lookup engine and method for fast packet forwarding in network routerFiled 2002·Application pending·0 cites
- 3533US2016328078A1Electronic device having touch screenSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →