Inventor · disambiguated record
Jaewha Park
Also filed as: PARK JAEWHA
4 granted patents·4 citations·filing 2018–2023
60Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0183US10566284B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 18, 2020·4 cites·20 claims
- 0270US12101923B2Semiconductor device including gate structure having first portion and second portion and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·14 claims
- 0367US11700722B2Method for manufacturing a semiconductor device using a support layer to form a gate structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 0450US11764145B2Wiring structure having double capping structure, manufacturing method thereof, and integrated circuit chip having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →