Inventor · disambiguated record
Jaehyun Phee
Also filed as: PHEE JAEHYUN
1 granted patent·2 pending applications·0 citations·filing 2021–2023
4Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0149US2024145416A1Substrate bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0247US11728197B2Wafer to wafer bonding apparatus and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·19 claims
- 0346US2024153906A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →