Inventor · disambiguated record
James Priest
Also filed as: PRIEST JAMES · PRIEST JAMES D
9 granted patents·2 pending applications·113 citations·filing 1979–2022
86Inventor score
Files withALLISON TRANSM INC5COOPER IND INC2OWENS CORNING INTELLECTUAL CAPITAL LLC2BELDEN CORP1OWENS CORNING FIBERGLAS TECH1
Top patents by PatentIndex Score
11 records- 0195US4274607AGuide device for use in elongate filament dispensing package and the likeBELDEN CORP·Filed 1979·Granted Jun 23, 1981·69 cites·12 claims
- 0287US9163674B2Final drive disconnect mechanismALLISON TRANSM INC·Filed 2013·Granted Oct 20, 2015·7 cites·9 claims
- 0378US9726227B2Final drive disconnect mechanismALLISON TRANSM INC·Filed 2015·Granted Aug 8, 2017·2 cites·18 claims
- 0471US11639208B2Final drive disconnect mechanism via transmissionALLISON TRANSM INC·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 0570US11332206B2Final drive disconnect mechanism via transmissionALLISON TRANSM INC·Filed 2020·Granted May 17, 2022·0 cites·19 claims
- 0665US7078451B2Formulation and process for compression molded component partsOWENS CORNING FIBERGLAS TECH·Filed 2002·Granted Jul 18, 2006·7 cites·30 claims
- 0760US10829169B2Final drive disconnect mechanism via transmissionALLISON TRANSM INC·Filed 2018·Granted Nov 10, 2020·0 cites·18 claims
- 0857US4897052AIntermediate electrical component for a molded plugCOOPER IND INC·Filed 1989·Granted Jan 30, 1990·22 cites·11 claims
- 0955US2023065267A1Composite parts with improved modulusOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2021·Application pending·0 cites
- 1051US2023094460A1Composite rebar with post-grinding surface treatmentOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2021·Application pending·0 cites
- 1146USD332937SMolded plugCOOPER IND INC·Filed 1990·Granted Feb 2, 1993·6 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when James Priest files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →