Inventor · disambiguated record
Jae-Chul Ryu
Also filed as: RYU JAE CHUL
11 granted patents·2 pending applications·105 citations·filing 1996–2019
87Inventor score
Files withSAMSUNG TECHWIN CO LTD4HAESUNG DS CO LTD3SAMSUNG AEROSPACE IND3RYU JAE-CHUL2HANWHA TECHWIN CO LTD1
Top patents by PatentIndex Score
13 records- 0177US7470461B2Printed circuit board and method of manufacturing the sameSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Dec 30, 2008·8 cites·13 claims
- 0274US5877941AIC card and method of fabricating the sameSAMSUNG AEROSPACE IND·Filed 1997·Granted Mar 2, 1999·49 cites·5 claims
- 0368US7199462B2Substrate for producing semiconductor packagesSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Apr 3, 2007·5 cites·8 claims
- 0463US5747222AMulti-layered circuit substrate and manufacturing method thereofSAMSUNG AEROSPACE IND·Filed 1996·Granted May 5, 1998·32 cites·9 claims
- 0562US7804693B2Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the sameSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Sep 28, 2010·3 cites·8 claims
- 0662US2020135357A1Electric wire structure and method of manufacturing thereofHAESUNG DS CO LTD·Filed 2019·Application pending·0 cites
- 0756US10714231B2Graphene wire, cable employing the same, and method of manufacturing the sameHAESUNG DS CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·10 claims
- 0852US2018190406A1Electric wire structure and method of manufacturing thereofHAESUNG DS CO LTD·Filed 2016·Application pending·0 cites
- 0951US7811626B2Printed circuit board and method of manufacturing the sameSAMSUNG TECHWIN CO LTD·Filed 2008·Granted Oct 12, 2010·0 cites·7 claims
- 1050US8122599B2Method of manufacturing a printed circuit board (PCB)RYU JAE-CHUL·Filed 2008·Granted Feb 28, 2012·1 cites·7 claims
- 1148US9373429B2Method of obtaining grapheneHANWHA TECHWIN CO LTD·Filed 2012·Granted Jun 21, 2016·0 cites·10 claims
- 1243US8227173B2Method of manufacturing multi-layer circuit boardRYU JAE-CHUL·Filed 2008·Granted Jul 24, 2012·0 cites·10 claims
- 1338US6074728AMulti-layered circuit substrateSAMSUNG AEROSPACE IND·Filed 1997·Granted Jun 13, 2000·7 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →