Inventor · disambiguated record
Jaime Saravia
Also filed as: SARAVIA JAIME · SARAVIA JAIME A
3 granted patents·424 citations·filing 1997–1997
79Inventor score
Files withMOTOROLA INC3
Top patents by PatentIndex Score
3 records- 0195US5897375AChemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufactureMOTOROLA INC·Filed 1997·Granted Apr 27, 1999·338 cites·32 claims
- 0272US6204169B1Processing for polishing dissimilar conductive layers in a semiconductor deviceMOTOROLA INC·Filed 1997·Granted Mar 20, 2001·42 cites·22 claims
- 0371US6045435ALow selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnectsMOTOROLA INC·Filed 1997·Granted Apr 4, 2000·44 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →