Inventor · disambiguated record
Jagat Shakya
Also filed as: SHAKYA JAGAT
5 granted patents·3 pending applications·7 citations·filing 2018–2023
66Inventor score
Files withINTEL CORP8
Top patents by PatentIndex Score
8 records- 0196US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 0266US11749628B2Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2022·Granted Sep 5, 2023·0 cites·15 claims
- 0355US11486923B2Apparatuses and methods for mitigating sticking of units-under-testINTEL CORP·Filed 2018·Granted Nov 1, 2022·0 cites·23 claims
- 0454US2025216449A1Integrated circuit testing structure for pad bond misalignment detection and measurementINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US11740282B1Apparatuses and methods for monitoring health of probing u-bump cluster using current dividerINTEL CORP·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 0653US2024113088A1Integrated circuit packages with hybrid bonded dies and methods of manufacturing the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 0751US2024413031A1On die flexure control device and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0850US12163982B2Microbump cluster probing architecture for 2.5D and 3D diesINTEL CORP·Filed 2022·Granted Dec 10, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →