Inventor · disambiguated record
Jayna Sheats
Also filed as: SHEATS JAYNA · SHEATS JAYNA R
14 granted patents·7 pending applications·419 citations·filing 2009–2023
92Inventor score
Top patents by PatentIndex Score
21 records- 0196US8124452B2Processes and structures for IC fabricationSHEATS JAYNA·Filed 2009·Granted Feb 28, 2012·226 cites·32 claims
- 0296US8020290B2Processes for IC fabricationSHEATS JAYNA·Filed 2009·Granted Sep 20, 2011·108 cites·15 claims
- 0395US8759713B2Methods for interconnecting bonding pads between componentsSHEATS JAYNA·Filed 2009·Granted Jun 24, 2014·65 cites·28 claims
- 0477US8247243B2Solar cell interconnectionSHEATS JAYNA·Filed 2010·Granted Aug 21, 2012·4 cites·17 claims
- 0573US9406644B2Chip separation process for photochemical component printingTEREPAC·Filed 2014·Granted Aug 2, 2016·4 cites·20 claims
- 0669US9224641B2Processes and structures for IC fabricationTEREPAC CORP·Filed 2014·Granted Dec 29, 2015·2 cites·20 claims
- 0764US8387238B2Processes and structures for IC fabricationSHEATS JAYNA·Filed 2009·Granted Mar 5, 2013·2 cites·30 claims
- 0863US8153517B2Processes and structures for IC fabricationSHEATS JAYNA·Filed 2009·Granted Apr 10, 2012·2 cites·7 claims
- 0960US8522848B2Methods and apparatuses for assembling components onto substratesSHEATS JAYNA·Filed 2009·Granted Sep 3, 2013·2 cites·14 claims
- 1058US8889482B2Methods to fabricate integrated circuits by assembling componentsSHEATS JAYNA·Filed 2009·Granted Nov 18, 2014·1 cites·17 claims
- 1158US8031217B2Processes and structures for IC fabricationSHEATS JAYNA·Filed 2009·Granted Oct 4, 2011·1 cites·32 claims
- 1250US8928118B2Processes and structures for IC fabricationTEREPAC CORP·Filed 2013·Granted Jan 6, 2015·0 cites·20 claims
- 1350US2015053774A1Methods to fabricate integrated circuits by assembling componentsTERPAC·Filed 2014·Application pending·0 cites
- 1450US2022317559A1Intermittently photobleached masks, methods of fabrication and uses for component transferTERECIRCUITS CORP·Filed 2022·Application pending·0 cites
- 1547US8513110B2Processes and structures for beveled slope integrated circuits for interconnect fabricationSHEATS JAYNA·Filed 2009·Granted Aug 20, 2013·0 cites·20 claims
- 1647US2023333475A1Composite material comprising a release material and a thermopolymer material, and uses thereofTERECIRCUITS CORP·Filed 2023·Application pending·0 cites
- 1746US8389057B2Systems and methods for printing electronic device assemblyKNOX DOUGLAS·Filed 2009·Granted Mar 5, 2013·2 cites·8 claims
- 1844US2022319829A1Assemblies used for embedding integrated circuit assemblies, and their uses and method of fabrication thereofTERECIRCUITS CORP·Filed 2022·Application pending·0 cites
- 1944US2022319900A1Selective donor plates, methods of fabrication and uses thereof for assembling components onto substratesTERECIRCUITS CORP·Filed 2022·Application pending·0 cites
- 2043US2011303359A1Roll-to-roll manufacturing of back-contacted solar cellsVAN DUREN JEROEN K J·Filed 2010·Application pending·0 cites
- 2135US2013192523A1Systems and methods for printing electronic device assemblyTEREPAC CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →