Inventor · disambiguated record
Jason Shen
Also filed as: SHEN JASON · SHEN JASON SHIH CHIEH
10 granted patents·63 citations·filing 2012–2020
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6HARBOR FREIGHT TOOLS USA INC2CHEN CHIN-LIANG1SHEN JASON SHIH CHIEH1
Top patents by PatentIndex Score
10 records- 0190US8916419B2Lid attach process and apparatus for fabrication of semiconductor packagesCHEN CHIN-LIANG·Filed 2012·Granted Dec 23, 2014·11 cites·20 claims
- 0289US9073492B1Adjustable bicycle carrierSHEN JASON SHIH CHIEH·Filed 2014·Granted Jul 7, 2015·25 cites·11 claims
- 0382US10513006B2High throughput CMP platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 24, 2019·5 cites·20 claims
- 0471US11972956B2Lid attach process and dispenser headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·24 claims
- 0571USD889234SScrewdriverHARBOR FREIGHT TOOLS USA INC·Filed 2019·Granted Jul 7, 2020·12 cites·1 claims
- 0665USD897181SScrewdriverHARBOR FREIGHT TOOLS USA INC·Filed 2019·Granted Sep 29, 2020·9 cites·1 claims
- 0763US10403532B2Semiconductor apparatus with inner wafer carrier buffer and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Sep 3, 2019·1 cites·20 claims
- 0860US11062931B2Semiconductor apparatus with inner wafer carrier buffer and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 0959US9502373B2Lid attach process and apparatus for fabrication of semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·0 cites·20 claims
- 1057US10685853B2Lid attach processes for semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 16, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →