Inventor · disambiguated record
Jayarama N. Shenoy
Also filed as: SHENOY JAYARAMA · SHENOY JAYARAMA N · SHENOY JAYARAMA NARAYAN
19 granted patents·2 pending applications·1,062 citations·filing 1997–2025
96Inventor score
Files withVLSI TECHNOLOGY INC5MICRON TECHNOLOGY INC3HYVE SOLUTIONS CORP2KONINKL PHILIPS ELECTRONICS NV2Kandou Labs SA2
Top patents by PatentIndex Score
21 records- 0197US6198635B1Interconnect layout pattern for integrated circuit packages and the likeVSLI TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·186 cites·31 claims
- 0296US6713375B2Method of making an electronic product including package-based inductor coupled to integrated circuitKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Mar 30, 2004·86 cites·3 claims
- 0396US6127811AMicro-electromechanical system and voltage shifter, method of synchronizing an electronic system and a micromechanical system of a micro-electromechanical systemVLSI TECHNOLOGY INC·Filed 1999·Granted Oct 3, 2000·183 cites·32 claims
- 0495US5994766AFlip chip circuit arrangement with redistribution layer that minimizes crosstalkVLSI TECHNOLOGY INC·Filed 1998·Granted Nov 30, 1999·248 cites·18 claims
- 0593US6310386B1High performance chip/package inductor integrationPHILIPS ELECTRONICS NA·Filed 1998·Granted Oct 30, 2001·78 cites·20 claims
- 0687US7133416B1Converting data signals in a multiple communication protocol system area networkMCDATA CORP·Filed 2002·Granted Nov 7, 2006·74 cites·46 claims
- 0785US10082975B1Obfuscation-enhanced memory encryptionMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 25, 2018·3 cites·22 claims
- 0882US6465311B2Method of making a MOSFET structure having improved source/drain junction performanceKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Oct 15, 2002·27 cites·11 claims
- 0982US6239472B1MOSFET structure having improved source/drain junction performancePHILIPS ELECTRONICS NA·Filed 1998·Granted May 29, 2001·46 cites·19 claims
- 1081US6025647AApparatus for equalizing signal parameters in flip chip redistribution layersVLSI TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·65 cites·30 claims
- 1180US6441470B1Technique to minimize crosstalk in electronic packagesSUN MICROSYSTEMS INC·Filed 2001·Granted Aug 27, 2002·27 cites·6 claims
- 1264US10387056B2Obfuscation-enhanced memory encryptionMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·0 cites·20 claims
- 1363US10180804B1Obfuscation-enhanced memory encryptionMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 15, 2019·0 cites·20 claims
- 1461US2025181542A1Retimer Module Interconnecting Passive CablesKandou Labs SA·Filed 2024·Application pending·0 cites
- 1556US2025238389A1Link telemetry reportingKandou Labs SA·Filed 2025·Application pending·0 cites
- 1655US6246121B1High performance flip-chip semiconductor deviceVLSI TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·21 cites·22 claims
- 1752US6515302B1Power devices in wide bandgap semiconductorPURDUE RESEARCH FOUNDATION·Filed 2000·Granted Feb 4, 2003·6 cites·7 claims
- 1846US5889389AMicro-electromechanical voltage shifterVLSI TECHNOLOGY INC·Filed 1998·Granted Mar 30, 1999·12 cites·23 claims
- 1944US12464638B2Vibration dampening for high-density storage system structureHYVE SOLUTIONS CORP·Filed 2023·Granted Nov 4, 2025·0 cites·18 claims
- 2040US12248343B2High-density storage system structureHYVE SOLUTIONS CORP·Filed 2023·Granted Mar 11, 2025·0 cites·17 claims
- 2140US6519747B2Method and apparatus for defining signal timing for an integrated circuit deviceSUN MICROSYSTEMS INC·Filed 2001·Granted Feb 11, 2003·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →