Inventor · disambiguated record
Jangbae Son
Also filed as: SON JANGBAE
1 granted patent·1 pending application·0 citations·filing 2022–2023
8Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0149US2024145326A1Semiconductor package manufacturing method and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0243US12469793B2Core substrate, package structure including the core substrate, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →