Inventor · disambiguated record
Jae Hun Song
Also filed as: SONG JAE HUN
12 granted patents·5 pending applications·18 citations·filing 2004–2022
85Inventor score
Files withMK ELECTRON CO LTD7HYUNDAI MOTOR CO LTD5LG DISPLAY CO LTD3LG PHILIPS LCD CO LTD1RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV1
Top patents by PatentIndex Score
17 records- 0187US11979483B2Encryption apparatus and method of an imageRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2022·Granted May 7, 2024·2 cites·11 claims
- 0279US11646285B2Semiconductor package using core material for reverse reflowMK ELECTRON CO LTD·Filed 2021·Granted May 9, 2023·1 cites·6 claims
- 0372US9759612B2Welding portion inspection system and the control method of inspection systemHYUNDAI MOTOR CO LTD·Filed 2014·Granted Sep 12, 2017·2 cites·10 claims
- 0470US11440124B2Joining apparatus for panel sheets and joining method for panel sheets using the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Sep 13, 2022·0 cites·3 claims
- 0570US9389621B2Compensation circuit for common voltage according to gate voltageLG DISPLAY CO LTD·Filed 2014·Granted Jul 12, 2016·1 cites·2 claims
- 0669US12030140B2Lead-free solder alloy and method of manufacturing electronic device using the sameMK ELECTRON CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·7 claims
- 0765US7417383B2Apparatus and method of driving lamp of liquid crystal display deviceLG DISPLAY CO LTD·Filed 2005·Granted Aug 26, 2008·2 cites·13 claims
- 0861US10391581B2Joining apparatus for panel sheets and joining method for panel sheets using the sameHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 27, 2019·0 cites·10 claims
- 0960US9792515B2Apparatus and method for recognizing stamped character and system for detecting stamped depth of character using the sameHYUNDAI MOTOR CO LTD·Filed 2013·Granted Oct 17, 2017·2 cites·9 claims
- 1060US7372214B2Apparatus and method for driving lamp of liquid crystal display deviceLG PHILIPS LCD CO LTD·Filed 2004·Granted May 13, 2008·8 cites·14 claims
- 1158US2022212293A1Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the sameMK ELECTRON CO LTD·Filed 2021·Application pending·0 cites
- 1246US10898978B2Apparatus for supplying fastener for joining panelsHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jan 26, 2021·0 cites·9 claims
- 1345US2021375811A1Pin-grid-array-type semiconductor packageMK ELECTRON CO LTD·Filed 2021·Application pending·0 cites
- 1436US7852018B2Apparatus and method of driving lamp of liquid crystal display deviceLG DISPLAY CO LTD·Filed 2008·Granted Dec 14, 2010·0 cites·7 claims
- 1535US2016244891A1Solder ball for fluxless bonding, method of manufacturing the same, and method of forming solder bumpMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 1626US2016315040A1Core for reverse reflow, semiconductor package, and method of fabricating semiconductor packageMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 1726US2016256962A1Lead-free solder having low melting pointMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →