Inventor · disambiguated record
Jani Valtanen
Also filed as: VALTANEN JANI
0 granted patents·4 pending applications·0 citations·filing 2007–2007
Technology areasH10W
Files withNOKIA CORP4
Top patents by PatentIndex Score
4 records- 0132US2008186690A1Electronics Package And Manufacturing Method ThereofNOKIA CORP·Filed 2007·Application pending·0 cites
- 0231US2008169574A1Direct Die AttachmentNOKIA CORP·Filed 2007·Application pending·0 cites
- 0331US2008176359A1Method For Manufacturing Of Electronics PackageNOKIA CORP·Filed 2007·Application pending·0 cites
- 0431US2008171450A1Wafer Bump Manufacturing Using Conductive InkNOKIA CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →