Inventor · disambiguated record
Jamil A. Wakil
Also filed as: WAKIL JAMIL · WAKIL JAMIL A · WAKIL JAMIL ABDUL
14 granted patents·5 pending applications·270 citations·filing 2002–2019
93Inventor score
Top patents by PatentIndex Score
19 records- 0197US8299608B2Enhanced thermal management of 3-D stacked die packagingBARTLEY GERALD K·Filed 2010·Granted Oct 30, 2012·60 cites·23 claims
- 0297US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0386US6622786B1Heat sink structure with pyramidic and base-plate cut-outsIBM·Filed 2002·Granted Sep 23, 2003·45 cites·18 claims
- 0485US6541847B1Packaging for multi-processor shared-memory systemIBM·Filed 2002·Granted Apr 1, 2003·36 cites·20 claims
- 0583US7698114B2Techniques for distributing power in electronic circuits and computer systemsIBM·Filed 2005·Granted Apr 13, 2010·16 cites·15 claims
- 0680US7319591B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2005·Granted Jan 15, 2008·7 cites·10 claims
- 0778US8900503B2Method of forming an overmolded dual in-line memory module cooling structureBORAAS MICHAEL A·Filed 2011·Granted Dec 2, 2014·4 cites·9 claims
- 0874US6829144B1Flip chip package with heat spreader allowing multiple heat sink attachmentIBM·Filed 2003·Granted Dec 7, 2004·20 cites·20 claims
- 0970US7167806B2Method and system for measuring temperature and power distribution of a deviceIBM·Filed 2004·Granted Jan 23, 2007·16 cites·9 claims
- 1068US7982475B2Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applicationsIBM·Filed 2006·Granted Jul 19, 2011·4 cites·11 claims
- 1166US8037594B2Method of forming a flip-chip packageIBM·Filed 2008·Granted Oct 18, 2011·2 cites·14 claims
- 1266US7489512B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2007·Granted Feb 10, 2009·2 cites·13 claims
- 1356US9943936B2Overmolded dual in-line memory module cooling structureLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2014·Granted Apr 17, 2018·0 cites·12 claims
- 1445US2022217870A1Circuit boards for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1544US2009045501A1Structure on chip package to substantially match stiffness of chipIBM·Filed 2007·Application pending·0 cites
- 1640US6793123B2Packaging for multi-processor shared-memory systemIBM·Filed 2003·Granted Sep 21, 2004·0 cites·20 claims
- 1739US2013168068A1Thermally enhanced cold plate having high conductivity thermal transfer pathsHUANG ZHEN·Filed 2011·Application pending·0 cites
- 1838US2020081505A1Thermal modules with conductive cover platesHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1930US2021199150A1Insulative layersHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →