Inventor · disambiguated record
Jason Yao
Also filed as: YAO JASON · YAO JASON J
5 granted patents·97 citations·filing 2001–2021
80Inventor score
Top patents by PatentIndex Score
5 records- 0197US11276643B2Semiconductor device with backside spacer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·5 cites·20 claims
- 0294US11038095B2Systems and methods for fabrication of superconducting integrated circuitsD WAVE SYSTEMS INC·Filed 2018·Granted Jun 15, 2021·17 cites·25 claims
- 0390US9634224B2Systems and methods for fabrication of superconducting circuitsD WAVE SYSTEMS INC·Filed 2015·Granted Apr 25, 2017·11 cites·10 claims
- 0489US6573156B1Low defect method for die singulation and for structural support for handling thin film devicesOMM INC·Filed 2001·Granted Jun 3, 2003·64 cites·27 claims
- 0560US11957065B2Systems and methods for fabrication of superconducting integrated circuitsD WAVE SYSTEMS INC·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →