Inventor · disambiguated record
Jaehyun Yeon
Also filed as: YEON JAEHYUN
21 granted patents·9 pending applications·17 citations·filing 2018–2025
90Inventor score
Files withQUALCOMM INC30
Top patents by PatentIndex Score
30 records- 0195US11183446B1X.5 layer substrateQUALCOMM INC·Filed 2020·Granted Nov 23, 2021·4 cites·28 claims
- 0293US11495873B2Device comprising multi-directional antennas in substrates coupled through flexible interconnectsQUALCOMM INC·Filed 2020·Granted Nov 8, 2022·5 cites·25 claims
- 0392US11239573B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·3 cites·17 claims
- 0490US12125742B2Package comprising a substrate with high density interconnectsQUALCOMM INC·Filed 2021·Granted Oct 22, 2024·2 cites·23 claims
- 0581US12126071B2Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Oct 22, 2024·1 cites·21 claims
- 0680US11545425B2Substrate comprising interconnects embedded in a solder resist layerQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·1 cites·24 claims
- 0776US11439008B2Package with substrate comprising variable thickness solder resist layerQUALCOMM INC·Filed 2021·Granted Sep 6, 2022·1 cites·25 claims
- 0870US2025259948A1Package comprising discrete antenna deviceQUALCOMM INC·Filed 2025·Application pending·0 cites
- 0969US11764489B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1063US2023155273A1Device comprising multi-directional antennas in substrates coupled through flexible interconnectsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1159US12293980B2Package comprising discrete antenna deviceQUALCOMM INC·Filed 2020·Granted May 6, 2025·0 cites·17 claims
- 1258US11399435B2Device comprising multi-directional antennas coupled through a flexible printed circuit boardQUALCOMM INC·Filed 2020·Granted Jul 26, 2022·0 cites·25 claims
- 1358US2025096051A1Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1454US11869833B2Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the sameQUALCOMM INC·Filed 2021·Granted Jan 9, 2024·0 cites·14 claims
- 1553US11823983B2Package with a substrate comprising pad-on-pad interconnectsQUALCOMM INC·Filed 2021·Granted Nov 21, 2023·0 cites·30 claims
- 1653US11735804B2Multi-core broadband PCB antennaQUALCOMM INC·Filed 2020·Granted Aug 22, 2023·0 cites·20 claims
- 1753US11637057B2Uniform via pad structure having covered traces between partially covered padsQUALCOMM INC·Filed 2019·Granted Apr 25, 2023·0 cites·8 claims
- 1853US2025226302A1Hybrid substrate with embedded componentQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1952US12300873B2Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methodsQUALCOMM INC·Filed 2022·Granted May 13, 2025·0 cites·33 claims
- 2050US11101220B2Through-package partial via on package edgeQUALCOMM INC·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 2150US11043740B2Enhanced antenna module with shield layerQUALCOMM INC·Filed 2019·Granted Jun 22, 2021·0 cites·19 claims
- 2249US11258165B2Asymmetric antenna structureQUALCOMM INC·Filed 2018·Granted Feb 22, 2022·0 cites·8 claims
- 2349US11139224B2Package comprising a substrate having a via wall configured as a shieldQUALCOMM INC·Filed 2019·Granted Oct 5, 2021·0 cites·22 claims
- 2448US11551939B2Substrate comprising interconnects embedded in a solder resist layerQUALCOMM INC·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 2548US11075260B2Substrate comprising recessed interconnects and a surface mounted passive componentQUALCOMM INC·Filed 2018·Granted Jul 27, 2021·0 cites·24 claims
- 2644US2021028539A1Enhanced Antenna Module with Flexible PortionQUALCOMM INC·Filed 2019·Application pending·0 cites
- 2743US2020091062A1Integrated circuit cavity formation with multiple interconnection padsQUALCOMM INC·Filed 2018·Application pending·0 cites
- 2842US2023014567A1Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 2940US2019371652A1Integrated circuit chip package having reduced contact pad sizeQUALCOMM INC·Filed 2018·Application pending·0 cites
- 3039US2019341352A1Tapered corner package for emi shieldQUALCOMM INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →