Inventor · disambiguated record
Jay A. Yoder
Also filed as: YODER JAY A · YODER JAY ALLEN
24 granted patents·1 pending application·99 citations·filing 2002–2023
94Inventor score
Files withSEMICONDUCTOR COMPONENTS IND12SEMICONDUCTOR COMPONENTS IND LLC9BURGHOUT WILLIAM F1CARNEY FRANCIS J1KNAPP JAMES HOWARD1
Top patents by PatentIndex Score
25 records- 0192US9484210B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 1, 2016·7 cites·44 claims
- 0290US8664089B1Semiconductor die singulation methodBURGHOUT WILLIAM F·Filed 2012·Granted Mar 4, 2014·19 cites·20 claims
- 0385US9034733B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted May 19, 2015·5 cites·20 claims
- 0480US9847219B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 19, 2017·2 cites·28 claims
- 0575US11984388B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 0674US6768186B2Semiconductor device and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jul 27, 2004·20 cites·21 claims
- 0770US7588999B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Sep 15, 2009·4 cites·14 claims
- 0869US11710686B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0968US7202105B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·12 cites·20 claims
- 1067US7298034B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Nov 20, 2007·12 cites·6 claims
- 1165US7875964B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jan 25, 2011·2 cites·9 claims
- 1261US7508060B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 24, 2009·2 cites·13 claims
- 1358US11217515B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 1457US10522448B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Dec 31, 2019·0 cites·18 claims
- 1557US8319323B2Electronic package having down-set leads and methodLETTERMAN JR JAMES P·Filed 2004·Granted Nov 27, 2012·10 cites·21 claims
- 1656US9558968B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Jan 31, 2017·0 cites·16 claims
- 1754US9870986B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 16, 2018·0 cites·17 claims
- 1853US7820528B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Oct 26, 2010·0 cites·17 claims
- 1951US7202106B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·3 cites·14 claims
- 2049US7498195B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 3, 2009·0 cites·8 claims
- 2146US9911684B1Holes and dimples to control solder flowSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Mar 6, 2018·0 cites·18 claims
- 2246US7598123B2Semiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Oct 6, 2009·0 cites·20 claims
- 2344US8253239B2Multi-chip semiconductor connectorCARNEY FRANCIS J·Filed 2010·Granted Aug 28, 2012·0 cites·4 claims
- 2439US2007117259A1Semiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Application pending·0 cites
- 2537US8574961B2Method of marking a low profile packaged semiconductor deviceKNAPP JAMES HOWARD·Filed 2003·Granted Nov 5, 2013·1 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →