Inventor · disambiguated record
Jae-Kyung Yoo
Also filed as: YOO JAE KYUNG
2 granted patents·3 pending applications·7 citations·filing 2006–2025
50Inventor score
Top patents by PatentIndex Score
5 records- 0185US10510724B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 17, 2019·6 cites·22 claims
- 0271US10867857B2Method of cutting substrate and method of singulating semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·14 claims
- 0347US2025349570A1Semiconductor package molding apparatus, semiconductor package molding system and semiconductor molding methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0435US2020273807A1Semiconductor package with silicon crystal structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0523US2009065128A1Method for Manufacturing A Solar ModuleYOO JAE-HAK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →