Inventor · disambiguated record
Jason Zhang
Also filed as: ZHANG JASON · ZHANG JASON JIEPING
5 granted patents·1 pending application·48 citations·filing 2004–2017
78Inventor score
Top patents by PatentIndex Score
6 records- 0175US7359211B2Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making sameINTEL CORP·Filed 2004·Granted Apr 15, 2008·16 cites·28 claims
- 0274US7218007B2Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devicesINTEL CORP·Filed 2004·Granted May 15, 2007·12 cites·21 claims
- 0373US7015592B2Marking on underfillINTEL CORP·Filed 2004·Granted Mar 21, 2006·18 cites·26 claims
- 0462US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 0555US2008150099A1Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making sameLANDEROS JUAN·Filed 2008·Application pending·0 cites
- 0652US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →