Inventor · disambiguated record
Jack Zhong
Also filed as: ZHONG JACK
0 granted patents·2 pending applications·0 citations·filing 2004–2006
Technology areasH10W
Files withZENG XIANG Y2
Top patents by PatentIndex Score
2 records- 0147US2006124985A1Methods of forming in package integrated capacitors and structures formed therebyZENG XIANG Y·Filed 2006·Application pending·0 cites
- 0241US2006081998A1Methods of forming in package integrated capacitors and structures formed therebyZENG XIANG Y·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →